On September 19-20, the Organization for Economic Co-operation and Development’s (OECD) Committee on Industry, Innovation, and Entrepreneurship (CIIE) and its Committee on Digital Economy Policy (CDEP) held the second meeting of the Semiconductor Informal Exchange Network.

Launched on June 30, 2023, with support from the U.S. International Technology Security and Innovation (ITSI) Fund, this network of multistakeholder officials involved in industrial policymaking, exchanges information on the current state of the semiconductor ecosystem and recent public and private industry initiatives in their respective countries.  The perspectives from industry and other stakeholders, including from labor, civil society and the technical community, are essential to better understand the semiconductor ecosystem, identify evolving needs, and inform the design of policy initiatives.

The two-day event included stakeholder presenters and leading sectoral experts drawn from private industry, semiconductor associations, and labor unions.  Ensuring the resilience of the global semiconductor ecosystem requires the involvement of all stakeholders.  The informal exchange network discussed ways to encourage more information sharing, recognizing that semiconductor value chains are complex.  Further information is needed on the different stages of the value chain, including inputs, production capacity, output, and inventories to shape effective government programs and mitigate the impact of supply chain disruptions.  The network is looking at how best to understand high impact risks and interdependencies that can weaken or destabilize the broader ecosystem, in order to build more resiliency into the global supply chain.

The United States is committed to working with partners and allies to expand the global semiconductor supply chain and foster transparency and collaboration to make global semiconductor supply chains more resilient.

For further information, please contact eb-press@state.gov or see the website: The U.S. Department of State International Technology Security and Innovation Fund.